Enhanced thermal conductivity and viscosity of copper nanoparticles in ethylene glycol nanofluid
نویسندگان
چکیده
in ethylene glycol nanofluid J. Garg, B. Poudel, M. Chiesa, J. B. Gordon, J. J. Ma, J. B. Wang, Z. F. Ren, Y. T. Kang, H. Ohtani, J. Nanda, G. H. McKinley, and G. Chen Department of Mechanical Engineering, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts 02139, USA Department of Physics, Boston College, Chestnut Hill, Massachusetts 02467, USA Materials and Nanotechnology Department, Research and Advanced Engineering, Ford Motor Company, Dearborn, Michigan 48121, USA School of Environmental Science and Engineering, Huazhong University of Science and Technology, People’s Republic of China School of Mechanical and Industrial Engineering, Kyung Hee University, South Korea
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